Successful development of MEMS and microsystems requires a number of technologies for their packaging, assembly, and low-cost fabrication. Packaging is especially critical in the successful operation and manufacturing of microsystems. The cost, long-term reliability, and yield of many microsystems are often dictated by the package. Techniques that are compatible with wafer-level fabrication, low-temperature processing, vacuum and hermetic encapsulation, and standard MEMS postfabrication approaches are needed in many applications. Many challenges remain, particularly with respect to material diversity and package integration. Wafer bonding is being investigated, and thin-film approaches are being increasingly developed. New methods of pattern transfer to bulk metals, glass, and ceramics are needed. In addition to packaging, assembly, and interconnection of different device substrates, MEMS and circuits are required in emerging microsystems. Together, micropackaging and microassembly techniques represent some of the primary obstacles in the successful commercial development of microsystems.

In addition to these, new fabrication technologies that allow the integration of MEMS, and circuits, improved understanding of materials and their properties, and offer new techniques for fabrication of three-dimensional micro-structures are needed. In the following section, a summary of ongoing projects related to micropackaging and fabrication technologies being carried out at WIMS is presented.